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LED CPU Heatsink Cooling Adhesive Thermal Conductive Silicone Rubber Pads Insulation Sheet Series of thermal conductive interface materials are used to fill the air gap between the heating element and the heat sink or metal base. Their flexibility and elasticity make it possible to cover very uneven surfaces. The heat is conducted from the separate device or the entire PCB to the metal casing or diffusion plate, thereby improving the efficiency and service life of the heating electronic components.
LED CPU Heatsink Cooling Adhesive Thermal Conductive Silicone Rubber Pads Insulation Sheet Series of thermal conductive interface materials are used to fill the air gap between the heating element and the heat sink or metal base. Their flexibility and elasticity make it possible to cover very uneven surfaces. The heat is conducted from the separate device or the entire PCB to the metal casing or diffusion plate, thereby improving the efficiency and service life of the heating electronic components.
LED CPU Heatsink Cooling Adhesive Thermal Conductive Silicone Rubber Pads Insulation Sheet Series of thermal conductive interface materials are used to fill the air gap between the heating element and the heat sink or metal base. Their flexibility and elasticity make it possible to cover very uneven surfaces. The heat is conducted from the separate device or the entire PCB to the metal casing or diffusion plate, thereby improving the efficiency and service life of the heating electronic components.